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(Apologies
for cross-posting.)
EURASIP
Journal on Advances in Signal Processing
Special
issue on Signal Processing in Advanced Nondestructive Materials Inspection
http://www.hindawi.com/journals/asp/si/ndt.html
Announce
and Call for papers
We
would appreciate if you could distribute this information by your colleagues
and co-workers.
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Dear
Colleague,
Nowadays,
techniques of nondestructive testing (NDT) have evolved greatly due to recent
advances in microelectronics and signal processing and analysis. For example,
many image processing and analysis techniques can now be readily applied at
standard video rates using commercially available hardware, in particular, to
methods that generate TV-type image sequences, such as real-time radiography,
pulse-video thermography, ultrasonic-phased array, laser ultrasonics, and
shearography.
The
main objective of this special issue on “Signal processing in nondestructive
materials inspection” (http://www.hindawi.com/journals/asp/si/ndt.html)
of the EURASIP
Journal on Advances in Signal Processing (http://www.hindawi.com/journals/asp/)
is
to promote a comprehensive forum for discussion on the recent advances in
signal processing techniques applied to nondestructive material inspection.
Topics
of interest include (not limited to):
-
Signal processing and analysis in advanced NDT;
-
Image processing and analysis in advanced NDT;
-
Materials characterization using advanced NDT;
-
Defect detection and characterization using advanced NDT;
-
Pattern recognition and classification for advanced NDT;
-
3D image reconstruction from advanced NDT data;
-
Applications of advanced NDT;
-
Algorithms development for signal processing and analysis in advanced NDT;
-
Software development for defect detection and characterization in NDT images.
Submission
Instructions:
Before
submission authors should carefully read over the journal's Author Guidelines,
which are located at http://www.hindawi.com/journals/asp/guidelines.html.
Prospective
authors should submit an electronic copy of their complete manuscript through
the journal Manuscript Tracking System at http://mts.hindawi.com/
according to the following timetable:
Manuscript
Due: January 1, 2010;
First
Round of Reviews: April 1, 2010;
Publication
Date: July 1, 2010.
Best
regards,
Joćo
Manuel R. S. Tavares, Department of Mechanical Engineering, Faculty of
Engineering, University of Porto, Portugal ([log in to unmask])
(Lead
Guest Editor)
Joćo
Marcos A. Rebello, Department of Metallurgy and Materials, Technological
Center, Faculty of Engineering, Federal University of Rio de Janeiro, Brazil ([log in to unmask])
(Guest
Editor)