Dear colleagues,
[Apologies for cross-posting]
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17th International ACM Conference on Tangible, Embedded, and Embodied
Interaction (TEI)
Call for Papers
26 February – 1 March 2023 in Warsaw, Poland
https://tei.acm.org/2023/
Abstract Deadline: 29 July 2022
Full submission Deadline: 05 August 2022
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TEI 2023 is the 17th annual conference dedicated to presenting the
latest results in tangible, embedded, and embodied interaction. The ACM
TEI conference has gained substantial visibility and activity over the
past decade. It brings together researchers, practitioners, businesses,
artists, designers and students from various disciplines, including
engineering, interaction design, computer science, product design, media
studies and the arts.
Topics and application areas are diverse, including: tangible user
interfaces, physical interaction design, flexible and shape changing
displays, haptic interaction, smart objects and cities, interactive
surfaces, augmented and mixed reality, ubiquitous computing, interactive
art and performance, social and wearable robotics, hybrid games,
embodied cognition and perception, fashion and material design,
furniture and architectural design, learning and education, music and
sound interfaces, human-augmentation, as well as productivity and
creativity tools in domains ranging from scientific exploration to
artistic practice. We invite submissions from a wide variety of
perspectives: theoretical, philosophical, conceptual, technical,
applied, and/or artistic.
The intimate size of this single-track conference provides a unique
forum for exchanging ideas and presenting innovative work through talks,
demonstrations, posters, art installations and performances, and
participation in hands-on studios and theoretical workshops.
CONTRIBUTION TYPES
Authors are invited to submit high-quality papers that contribute to
advancing this rapidly developing field. Authors are encouraged to
submit a paper with a length proportional to its contribution and thus
there are no maximum (or minimum) length papers. If your research
contribution requires only 6, 8, or 12 pages (single column, plus
references), please submit a paper of that length. Reviewers will be
instructed to weigh the contribution of a submission relative to its
length. Papers should be succinct, but thorough in presenting the work.
Shorter, more focused papers are encouraged and will be reviewed like
any other paper. Papers whose lengths are incommensurate with their
contributions will be rejected.
We highlight the following non-exclusive set of contribution types:
Artifact: We welcome submission of research artifacts that advance the
state of the art in Tangible, Embedded and Embodied Interaction.
Artifacts can demonstrate new technologies (e.g., new sensing techniques
or algorithms), new forms of input (e.g., novel interaction techniques)
or new designs (e.g., provocative or evocative objects, systems or
services).
Method: Tools, approaches and techniques that enable researchers,
technologists, designers and practitioners to study, research and work
on Tangible, Embedded and Embodied Interaction. Methods can include new
forms of study design or data analysis, new engineering processes or
frameworks that can structure and constrain generative design activity.
Theory: Explorations, extensions, refutions, instantiations and other
developments of and to the theories pertaining to Tangible, Embedded and
Embodied Interaction, such as theories of cognition or the mind and
designerly theories and conceptual frameworks.
Empirical: Studies and data that add to our understanding of Tangible,
Embedded and Embodied Interaction by, for example, providing
quantitative accounts of salient aspects of human performance or
qualitative characterizations of experiences with tangible artifacts and
systems. Empirical submissions can detail outcomes from a very wide
range of lab, field and online studies.
Respecting the diversity of approaches and methods that together make up
TEI, each contribution type will be peer-reviewed on its own merits. We
seek high-quality work regardless of the specific subdomain or topic and
we expect the work to be positioned firmly in, and building on, prior
research in our field, in particular wherever relevant referencing work
that was presented at earlier TEI conferences.
Accepted submissions of all contribution types will be included as
papers in the conference proceedings, which will be available in the ACM
Digital Library.
Important Dates:
Abstract Deadline: 29 July 2022
Full submission Deadline: 05 August 2022
Notification of conditional acceptance: October 4, 2022
Revised Paper submission deadline: October 25, 2022
Notification of final acceptance: November 18, 2022
Camera-ready deadline: November 29, 2022
TEI 2023 conference: February 26-March 1, 2023
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