[Apologies for multiple copies]
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IEEE SMARTCOMP 2019
Call for Papers
12-15 June 2019, Washington DC, USA
http://www.smart-comp.org
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SMARTCOMP is the premier conference on smart computing. Smart computing is based on the synergistic combination of advances in Sensor-based technologies, the Internet of Things (IoT), Cyber-Physical Systems, Edge computing, Big Data analytics, Machine Learning, Cognitive Computing, and Artificial Intelligence.
Smart computing is a multidisciplinary domain. Applications of smart computing can be found in different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, entertainment, and social media. Algorithmic and system advancements of cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking and social computing are taking smart computing to a new dimension and improving our ways of living.
SMARTCOMP 2019 is the 5th edition of the conference and will held in Washington, USA and will include smart computing innovations pertaining to pervasive/ubiquitous computing, cloud computing, sensor networks, internet of things, big data analytics, security and privacy, social computing, cognitive computing, cyber-physical systems and their application and validation within smart computing environments. This includes applications such as smart buildings, smart cities, smart grids, precision agriculture and other innovations contributing to smart living.
Submission Guidelines
Paper submissions must be no longer than 8 pages and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at IEEE conference template. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.
Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that). Prior to submission, ensure that any running headers/footers, page numbering, as well as blue underlining for URLs and email addresses has been removed.
All submitted papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All presented papers will be published in the conference proceedings and submitted to the IEEE Xplore Digital Library.
Topics
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SMARTCOMP 2019 solicits submissions that address the fundamental questions of smart computing, namely how to design and build smart computing systems and how to use computing technology for resource sustainability to improve the human experience. Submissions should thus match to at least one of the following three major fields of interest:
SMART COMPUTING CONCEPTS, MODELS AND ALGORITHMS:
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Future Smart Computing Paradigms
Models of Smart Environments
Algorithms for Smart Computing
AI and Machine Learning in Smart Computing
Edge computing platforms and algorithms
SMART COMPUTING SYSTEMS:
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Security, Privacy, and Economics in Smart Environments
Cyber-physical System Platforms for Smart Environments
Middleware Platforms for Smart Environments
Mobile and Ubiquitous Platforms for Smart Environments
SMART COMPUTING TECHNOLOGIES AND APPLICATIONS:
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Smart Precision Agriculture
Smart Transportation
Smart FinTech
Smart Food-Energy-Water Nexus/Life-cycle analysis
Smart Health
Smart Communities
Smart Human Environments, Entertainment, and Social Activities
Smart Energy Management and Analytics
Organizing Committee
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General Co-Chairs:
Aryya Gangopadhyay (University of Maryland Baltimore County, USA)
Antonio Puliafito (University of Messina, Italy)
Technical Program Co-Chairs:
Raghu Ganti (IBM T. J. Watson Research Center, USA)
Julie McCann (Imperial College London, UK)
Workshops Co-Chairs:
Dario Bruneo (University of Messina, Italy)
Christine Julien (University of Texas at Austin, USA)
Keynote Co-Chairs:
Mudhakar Srivatsa (IBM T J Watson Research Center)
WIP and Demo Chair:
Shiqiang Wang (IBM T J Watson Research Center)
PhD Forum Chair:
Nirupam Roy (University of Illinois Urbana–Champaign, USA)
Publication Chair:
TBC
Registration and Finance Chair:
Carmen Au (Hong Kong Polytechnic University, Hong Kong)
Maciej Zawodniok (Missouri University of Science and Technology, USA)
Publicity Co-Chairs:
Baek-Young Choi (University of Missouri - Kansas City, USA)
Hemant Purohit (George Mason University, USA)
Francesca Righetti (University of Pisa, Italy)
Hesheng Wang (Shanghai Jiao Tong University, China)
Local Arrangement Chair:
Nirmalya Roy (University of Maryland Baltimore County, USA)
Web Chair:
Sreenivasan Ramasamy Ramamurthy (University of Maryland Baltimore County, USA)
Anamika Paul Rupa (University of Maryland Baltimore County, USA)
Steering Committee
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Jiannong Cao (Hong Kong Polytechnic University, Hong Kong)
Sajal K. Das (Missouri University of Science and Technology, USA)
TPC
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Christian Becker, University of Mannheim
Paolo Bellavista, University of Bologna
Dario Bruneo, University of Messina
Alessandra De Paola, University of Palermo
Wan Du, University of California at Merced, USA
Angelo Furno, IFSTTAR-France
Mohammad Hajiesmaili, The Chinese University of Hong Kong
Fanxin Kong, University of Pennsylvania
Ulf Kulau, TU Braunschweig
Symeon Papavassiliou, National Technical University of Athens
Kyung-Joon Park, DGIST
Lucas Pereira, Madeira Interactive Technologies Institute (M-ITI)
Dirk Pesch, Nimbus Centre For Embedded Systems Research, Cork Institute of Technology
Carlo Puliafito, University of Pisa
Andreas Reinhardt, TU Clausthal
Nirmalya Roy, University of Maryland Baltimore County
Nishanth Sastry, KCL
Vijay Srinivasan, Samsung R&D
Neeraj Suri, TU Darmstadt
Hwee-Pink Tan, Singapore Management University
Athena Vakali, Aristotle University of Thessaloniki
Carlo Vallati, Department of Information Engineering, University of Pisa
Desheng Zhang, Rutgers
Eugenio Zimeo, University of Sannio
Important Dates
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Workshop Proposal Submission: 23 November 2018
Notification of Workshop Acceptance: 15 December 2018
Paper Registration Deadline: 14 January 2019
Paper Submission Deadline: 28 January 2019
Acceptance Notification: 29 March 2019
Camera Ready Deadline: 28 April 2019
Venue
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The 5th IEEE International Conference on Smart Computing (SMARTCOMP 2019) will be held at Washington DC, USA.
Contact
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For any Information about the conference, please contact the TPC Co-Chairs: Raghu Ganti or Julie McCann.
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