THIRD INTERNATIONAL CONFERENCE ON TANGIBLE AND EMBEDDED INTERACTION
16-18 FEBRUARY 2009, CAMBRIDGE, UK
SECOND CALL FOR PARTICIPATION
http://tei-conf.org
IMPORTANT DATES
Submission deadline 31st Oct 08
Reviews due 27th Nov 08
Author notification deadline 30th Nov 08
Camera-ready copy deadline 15th Dec 08
Early registration deadline 7th Jan 09
Conference dates 16th – 18th Feb 09
KEYNOTE SPEAKERS
We are excited to confirm that the TEI keynote addresses will be
delivered by Tom Igoe and Durrell Bishop.
DESCRIPTION
Computing is progressively moving beyond the desktop into new physical
and social contexts. One key area of innovation has been around
tangible computing, which pushes the user interface beyond the digital
into the physical world by means of mobile devices, graspable
interfaces, physical computing and interactive surfaces. A closely
related topic is that of embedded interaction where the everyday
objects and environments we interact with are computationally
augmented in new ways. Designing such systems requires
interdisciplinary thinking. Their creation must not only encompass
software, electronics, and mechanics, but also the system's physical
form and behaviour, and its social impacts.
After the big success of TEI'07 and TEI'08 we are pleased to invite
you to participate in TEI'09 to present the latest results in tangible
and embedded interaction. We invite submissions of work addressing HCI
issues, design, user experience, tools and technologies, as well as
interactive art in the broad area of tangible computing and embedded
interactive systems. The intimate size of this single-track conference
provides a unique forum for exchange of ideas through talks,
interactive exhibits, demos, posters, art installations and
performances. All accepted submissions will be included in the
conference proceedings, which will be published through the ACM
Digital Library.
TOPICS FOR SUBMISSION
Authors are invited to submit high-quality original work to advance
the field. Appropriate topics include but are not limited to:
* Examples of novel tangible interfaces or embedded interactive systems
* Interactive uses of sensors and actuators, and electronics and mechatronics
* Case studies and evaluations of working deployments
* Relation of tangible and embedded interaction to other paradigms
* Applied design in the form of concept sketches, prototypes and products
* Programming paradigms and tools, toolkits, software architectures
* Novel enabling technologies
* Design guidelines and methods
* Novel applications
* Theoretical foundations, frameworks, and concepts
* Philosophical, ethical and social implications
* Usability
* Provocative design work and interactive art
SUBMISSION DETAILS
Authors are invited to submit papers that are 2, 4, 6 or 8 pages long,
formatted to follow the two column ACM SIGCHI format, and submitted
electronically via the conference website. We are happy to consider a
variety of styles for inclusion in the proceedings, such as academic
papers, design sketches and descriptions of art pieces or
installations. At the time of submission, authors will be able to
specify their preferred format for presenting the work, which
includes:
* 15 minute talk * Interactive demo
* 5 minute talk * Exhibit
* Poster * Installation
You can find more details on the submission requirements and review
process online at http://tei-conf.org.
ORGANIZING COMITTEE
CONFERENCE CHAIRS
Nicolas Villar Microsoft Research Cambridge, UK
Shahram Izadi Microsoft Research Cambridge, UK
PROGRAM CHAIRS
Mike Fraser University of Bristol, UK
Steve Benford University of Nottingham, UK
SPONSORSHIP CHAIR
Sriram Subramanian University of Bristol, UK
PUBLICITY CHAIRS
Jamie Zigelbaum MIT Media Lab, USA
Florian Block Lancaster University, UK
Nicolai Marquardt University of Calgary, Canada
Takashi Matsumoto Pileus LLC, Japan
DESIGN
Bart Hengenveld Eindhoven University of Technology, NL
Christian Zoellner UDK Berlin, Germany
WEBMASTER
Nicolai Marquardt University of Calgary, Canada
PUBLICATION CHAIRS
Dagmar Kern University of Duisburg-Essen, Germany
Alireza Sahami University of Duisburg-Essen, Germany
PROGRAM COMMITTEE
Alan Blackwell University of Cambridge, UK
Ali Mazalek Georgia Institute of Technology, USA
Alissa Antle Simon Fraser University, Canada
Andrew Smith Meraka Institute, South Africa
Astrid Larssen University of Technology, Sydney
Beat Signer ETH Zurich, Switzerland
Boriana Koleva University of Nottingham, UK
Bruce Thomas University of South Australia, Australia
Chris Schmandt MIT Media Lab, USA
Darren Edge Microsoft Research Beijing, China
Denis Lalanne University of Fribourg, Switzerland
Dzmitry Aliakseyeu Philips Research, NL
Ehud Sharlin University of Calgary, Canada
Elise van den Hoven TU Eindhoven, NL
Ellen Do Georgia Institute of Technology, USA
Florian Block Lancaster University, UK
Floyd Mueller The University of Melbourne, Australia
Giulio Jacucci HIIT, Finland
Hans Gellersen Lancaster University, UK
Hayes Raffle Nokia Research, USA
Ivan Poupyrev Sony CSL, Japan
Jon Hindmarsh King's College London, UK
Jonna Häkkilä Nokia, Finland
Karl-Petter Åkesson SICS, Sweden
Kimiko Ryokai UC Berkeley, USA
Kristina Andersen STEIM, NL
Kristof Van Laerhoven TU Darmstadt, Germany
Luigina Ciolfi University of Limerick, Ireland
Mark Billinghurst HIT Lab, New Zealand
Mark Gross Carnegie Mellon University, USA
Michael Evans Virginia Tech, USA
Miguel Nacenta University of Saskatchewan, Canada
Morten Fjeld Chalmers University of Technology, SE
Paul Holleis University of Duisburg-Essen, Germany
Paul Marshall The Open University, UK
Peter Krogh Aarhus School of Architecture, DK
Sergi Jorda Universitat Pompeu Fabra, Spain
Stefan Marti Samsung, USA
Tom Gross Bauhaus-University Weimar, Germany
Yoshifumi Kitamura Osaka University, Japan
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